The latest gadgets hitting the market are smaller and faster than ever before, and rapidly-emerging 3D integration technology plays a major role in this evolution. The process, which consists in stacking 2D dies and connecting them in the 3rd dimension in order to speed up communication between chips, can be found in appliances such as miniaturised implantable medical devices and radio frequency devices found in mobile phones. It stacks and interconnects multiple materials, technologies, and functional components to form highly integrated micro and nanosystems for cross-sector applications.
FAB2ASM, an EU-backed project that set out to develop a new manufacturing technology for the 3D integration of microelectronics and Microsystems, has recently come to term and published positive results. The team addressed a major shortfall in technology development time and precision that hinders industrial output by joining traditional robotic tools with the physics of self-alignment – where tiny chips align due to surface tension of liquid or other physical forces acting at the micro-scale level.
The main approach starts with component and interface design. In the process, chips fed by high speed robots are accurately aligned to the targets by self-assembly followed by permanent bonding to obtain 3-Dimensional devices.
3D integration is a very promising area of technological development and carries huge economic potential. ‘Supporting the development of micro-assembling techniques through this project will allow for keep our industries afloat in a very competitive international environment’ said Dr Michael Gauthier, FAB2ASM coordinator.
Read more at: Phys.org